Electrodeposición y caracterización morfológica de capas de NiSx sobre espuma de níquel

Autores/as

DOI:

https://doi.org/10.24054/rcta.v2i48.4560

Palabras clave:

electrodeposición, sulfuro de níquel, espuma de níquel, recubrimientos NiSx, FESEM, EDX, morfología superficial, relación Ni/S

Resumen

En este trabajo se evaluaron dos rutas de electrodeposición para obtener recubrimientos de sulfuro de níquel (NiSx) sobre sustratos de espuma de níquel. El objetivo fue comparar el efecto de las condiciones de deposición sobre la morfología superficial, el espesor del recubrimiento y la relación elemental Ni/S de las películas obtenidas. La primera ruta se desarrolló mediante electrodeposición potenciodinámica a una velocidad de barrido de 5 mV/s, entre -0.54 y -1.44 V, durante ocho ciclos. La segunda ruta se realizó mediante dos escalones de densidad de corriente, aplicando 10 mA/cm2 durante 90 min y 100 mA/cm2 durante 75 min. Los recubrimientos obtenidos fueron caracterizados mediante microscopía electrónica de barrido por emisión de campo (FESEM) y espectroscopía de energía dispersiva de rayos X (EDX). La síntesis 1 produjo una película relativamente uniforme, con morfología granular fina y crecimiento laminar asociado a los ciclos de deposición, con un espesor promedio aproximado de 720 nm y una relación atómica Ni/S cercana a 1:1. La síntesis 2 generó una morfología superficial tipo coliflor, con un espesor promedio aproximado de 700 nm y una relación atómica Ni/S cercana a 2.5:1. Estos resultados muestran que las condiciones de electrodeposición modifican de manera significativa la microestructura, el modo de crecimiento y la composición elemental de los recubrimientos NiSx sobre espuma de níquel. El estudio aporta información experimental útil para el diseño y optimización de películas de sulfuro de níquel obtenidas por electrodeposición.

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Publicado

2026-07-07

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